Tsmc’S Next Major Milestone In The Us Would Be The Opening Of A New Advanced Packaging Facility By 2029, Coming One Step Closer Towards An Independent Supply Chain
TSMC’s 2nm Chip to See the Fiercest Competition Yet Among AI Customers as Next-Gen AI Chips Are Expected to Heavily Rely on the Process TSMC Needs to Double Production Over the Next Decade Just to Meet NVIDIA’s Demand, Says Jensen Huang, Highlighting the Future Scale of the AI Boom TSMC’s 2nm Chip to See the Fiercest Competition Yet Among AI Customers as Next-Gen AI Chips Are Expected to Heavily Rely on the Process