Huawei’s Kirin 9030 Chip Is Testing The Limits Of DUV-Based Multi-Patterning Lithography
Home » PostsChina’S Smic Is Expanding Advanced Packaging Efforts By Establishing A Research Center To Explore New Ways To Scale Performance Beyond Moore’S LawDecember 14, 2025 · 1 min · 12 words · Antionette MontemurroTable of ContentsHuawei’s Kirin 9030 Chip Is Testing The Limits Of DUV-Based Multi-Patterning LithographyHuawei’s Kirin 9030 Chip Is Testing The Limits Of DUV-Based Multi-Patterning Lithography#
