Intel Showcases Its Next-Level & Massively Scalable Packaging Capabilities: >12X Reticle With 16 Compute Tiles On 18A/14A Nodes, Up To 24 HBM Sites & Leveraging Advanced Foveros 3D & EMIB Technologies

Ex Qualcomm & AMD GPU Architect, Eric Demers, Joins Intel To Accelerate Graphics & AI Roadmap

There Is “Zero Chance” That Apple iPhone Chips Will Leverage Intel’s Advanced Nodes, Claim Industry Insiders