NVIDIA Looks to Intel’s 18A/14A Process and EMIB Packaging for Next-Gen Feynman AI Chips, Signaling a Major Foundry Shift Beyond TSMC

Intel Showcases Industry’s First “Glass Core” Substrates With EMIB Advanced Packaging, Acting as a Key Enabler For Next-Generation AI Chips

Intel Gaming Handheld-Specific Panther Lake Chips Rumoredly Delayed To Second Quarter 2026