Tsmc’S Next Major Milestone In The Us Would Be The Opening Of A New Advanced Packaging Facility By 2029, Coming One Step Closer Towards An Independent Supply Chain

January 18, 2026 · 1 min · 73 words · Lenora Farley

Table of Contents

TSMC’s 2nm Chip to See the Fiercest Competition Yet Among AI Customers as Next-Gen AI Chips Are Expected to Heavily Rely on the Process
TSMC Needs to Double Production Over the Next Decade Just to Meet NVIDIA’s Demand, Says Jensen Huang, Highlighting the Future Scale of the AI Boom
TSMC’s 2nm Chip to See the Fiercest Competition Yet Among AI Customers as Next-Gen AI Chips Are Expected to Heavily Rely on the Process

TSMC’s 2nm Chip to See the Fiercest Competition Yet Among AI Customers as Next-Gen AI Chips Are Expected to Heavily Rely on the Process

TSMC Needs to Double Production Over the Next Decade Just to Meet NVIDIA’s Demand, Says Jensen Huang, Highlighting the Future Scale of the AI Boom

TSMC’s 2nm Chip to See the Fiercest Competition Yet Among AI Customers as Next-Gen AI Chips Are Expected to Heavily Rely on the Process